Dr. Anirban Sengupta is an Associate Professor in Computer Science and Engineering at Indian Institute of Technology (I.I.T) Indore. He is an elected Fellow of IET and Fellow of British Computer Society (FBCS), UK. He is a registered Professional Engineer of Ontario (P.Eng.). He has been awarded prestigious IEEE Distinguished Lecturer by IEEE Consumer Electronics Society in 2017 and IEEE Distinguished Visitor by IEEE Computer Society in 2019.
He has more than 212 Publications including 3 Books and 11 Patents. He is author of 3 Books from IET and Springer on Hardware Security, IP core protection and VLSI Design. He is currently Deputy Editor-in-Chief of IET Computers and Digital Techniques Journal and Editor-in-Chief of IEEE VLSI Circuits & Systems Letter of IEEE Computer Society TCVLSI. He is currently the Chairman of IEEE Computer Society TCVLSI. He currently serves/served in more than 16 Editorial positions of several IEEE Transactions/Journals, IET and Elsevier Journals including IEEE Transactions on Aerospace and Electronic Systems (TAES), IEEE Transactions on VLSI Systems, IEEE Transactions on Consumer Electronics, IEEE Access Journal, IET Journal on Computer & Digital Techniques, IEEE Consumer Electronics, IEEE Canadian Journal of Electrical and Computer Engineering, IEEE VLSI Circuits & Systems Letter and other Journals. He is recipient of several IEEE Honors such as IEEE Outstanding Editor Awards, IEEE Outstanding Service Awards and IEEE Best Paper Awards from Journals/Magazines and Conferences. He was the General/Conference Chair of 37th IEEE International Symposium on Consumer Electronics (ICCE) 2019, Las Vegas and Technical Program Chair of 36th IEEE International Conference on Consumer Electronics (ICCE) 2018 in Las Vegas, 9th IEEE International Conference on Consumer Electronics (ICCE) - Berlin 2019, 15th IEEE International Conference on Information Technology (ICIT) 2016, 3rd IEEE International Symposium on Nanoelectronic and Information Systems (iNIS) 2017 . His patents have been used and cited in industry patents/products of IBM Corporation, Siemens Corporation, Qualcomm, Amazon Technologies, Siemens (Germany), Mathworks Inc, Ryerson University and STC University of Mexico multiple times.